氰酸酯树脂/聚苯醚/纳米二氧化硅电子封装材料固化动力学研究

张梦萌颜红侠管兴华王倩倩

Study on Curing Kinetics of Cyanate Ester/Polyphenylene Oxide/Nano-SiO2 Electronic Encapsulating Material

Mengmeng ZHANG Hongxia YAN Xinghua GUAN Qianqian WANG

中国塑料 . 2012, (04): 40 -44 . DOI: 10.19491/j.issn.1001-9278.2012.04.008