China Plastics ›› 2018, Vol. 32 ›› Issue (02): 91-97.DOI: 10.19491/j.issn.1001-9278.2018.02.015

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Study on Numerical Simulation of Thermal Viscoelastic Plastic Deformation Filling Mechanism in Micro-hot Embossing Process of Polymers

  

  • Received:2017-09-02 Revised:2017-09-28 Online:2018-02-26 Published:2018-02-26

Abstract: This paper reported a study on the patterning superhydrophobic surface with a PMMA-pillared array based on the micro-hot embossing technology. The effect of process parameters on the micro hot embossing process was investigated by means of numerical simulation, and the thermal viscoelastic plastic deformation filling mechanism was described. Moreover, the key control parameters were clarified. The results indicated that the elastic modulus of the base materials, hot embossing temperature and pressure are the key control parameters for the micro-hot formation. The hot embossing pressure and deformation stress were reciprocally correlated with the hot embossing temperature, whereas the filling height of polymers was proportionally correlated with the hot embossing temperature. With increasing hot embossing temperature over the glass transition temperature of a polymeric base material, the base material could be kept in a high elastic state. In this case, the base material is easy to perform a significant thermal viscoelastic plastic deformation in a rapid way, which can minimize the hot embossing pressure and deformation stress. This is beneficial for polymeric base materials to avoid fracture damages and promote filling flow.