China Plastics ›› 2015, Vol. 29 ›› Issue (09): 60-66 .DOI: 10.19491/j.issn.1001-9278.2015.09.012
Previous Articles Next Articles
Received:
Revised:
Online:
Published:
Abstract: A mechanical system for inmold micro assembly molding was proposed. A theoretical model was formulated to describe the mechanism of thermalfluidstructure coupling deformation in polymer inmold micro assembly molding. Through finite element numerical simulation, the influence of the die wall temperature on the inmold micro assembly was studied. It was found that the micro assembly was controlled by its thermalfluidstructure coupling pressure field and inhomogeneous temperature field, and its microassembly thermalfluidstructure coupled deformation increased with increasing die wall temperature. Reducing of die wall temperature would help improve its micro assembly molding precision.
Key words: micro-machines, in-mold micro assembly molding process, thermal-fluid-structure coupling
0 / / Recommend
Add to citation manager EndNote|Ris|BibTeX
URL: https://www.plaschina.com.cn/EN/10.19491/j.issn.1001-9278.2015.09.012
https://www.plaschina.com.cn/EN/Y2015/V29/I09/60