×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
在这里添加一些文本
Close
×
Toggle navigation
China Plastics
Home
About
Introduction
Editorial board
Honor
Database
Submission
Instruction
Column introduction
Manuscript
Collection
Papers
Copyright transfer
Journal
Current Issue
Archive
Subscription
Advertising
Media introduction
Advertisement
Advertising requirements
Contact us
中文
Relationship between Cooling Rate and Relaxation Rate of PMMA During Micro Hot Embossing Process in Solid-like State
李瑞 吴大鸣 王琦 刘颖 孙靖尧 曹亚楠
China Plastics . 2017, (
12
): 78 -83 . DOI: 10.19491/j.issn.1001-9278.2017.12.014
