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中文
Study on 3D printing of flexible liquid metal circuits with encapsulation on a polyimide substrate
GUO Hengrui, WANG Fei, BAI Yanjun, BI Jingxin, CHENG Qianshuai, YANG Wenzhao, WANG Wenzhuo
China Plastics . 2025, (
12
): 64 -71 . DOI: 10.19491/j.issn.1001-9278.2025.12.011
