中国塑料 ›› 2014, Vol. 28 ›› Issue (12): 93-98.DOI: 10.19491/j.issn.1001-9278.2014.12.019

• 塑料与环境 • 上一篇    下一篇

聚丙烯/废印刷电路板非金属粉复合材料的结构与性能

熊煦1,陈晓松2,侯文顺1,龚方红3   

  1. 1. 常州工程职业技术学院
    2. 常州大学城常州工程学院
    3. 常州大学材料科学与工程学院
  • 收稿日期:2014-05-29 修回日期:2014-07-10 出版日期:2014-12-26 发布日期:2014-12-26
  • 基金资助:
    常州工程职业技术学院院级重点课题(KJ14303)

Structure and Property of Polypropylene /Waste Printed Circuit Boards Nonmetallic Powder Composites

  • Received:2014-05-29 Revised:2014-07-10 Online:2014-12-26 Published:2014-12-26

摘要: 以废印刷电路板非金属粉(废PCB粉)为填料,采用熔融共混法制备了聚丙烯/废印刷电路板非金属粉复合材料,通过差示扫描量热分析(DSC) 、热重分析(TGA)、动态力学性能分析(DMA) 和扫描电镜分析(SEM)等方法,研究了废PCB粉和PP在不同质量配比下,复合材料的结晶熔融行为、热稳定性能、动态力学性能和冲击断面形貌。结果显示:随着废PCB粉的加入,复合材料的结晶速率和结晶度提高,热稳定性增强,储能模量得到提高,但熔点、力学损耗因子峰值和玻璃化转变温度有所下降;废PCB粉均匀分布于PP基体中,界面黏结性较好。

Abstract: Polypropylene matrix composites was prepared by melt blending which filled with nonmetallic powder from waste printed circuit boards. Changes of crystallization and melting behavior, thermal stability, dynamic mechanical properties and impact fracture surface morphology of composites were analyzed with differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and scanning electron microscope analysis(SEM), respectively. The results demonstrate that crystallization rate, crystallinity, thermal stability and storage modulus of composites enhance obviously, while melting point, mechanical loss factor and glass transition temperature decrease slightly. The waste PCB powder are evenly distributed on PP, the interfacial adhesion is better.

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