PMMA在类固态微热压印过程中冷却速率与松弛速率的规律分析

doi:10.19491/j.issn.1001-9278.2017.12.014

中国塑料 ›› 2017, Vol. 31 ›› Issue (12): 78-83.DOI: 10.19491/j.issn.1001-9278.2017.12.014

PMMA在类固态微热压印过程中冷却速率与松弛速率的规律分析

李瑞¹,吴大鸣¹,王琦²,刘颖¹,孙靖尧²,曹亚楠¹

1. 北京化工大学
2. 北京化工大学机电工程学院

收稿日期:2017-07-26 修回日期:2017-09-05 出版日期:2017-12-26 发布日期:2017-12-29
基金资助:
类固态聚合物等温微纳热压印成型机理的研究

Relationship between Cooling Rate and Relaxation Rate of PMMA During Micro Hot Embossing Process in Solid-like State

Received:2017-07-26 Revised:2017-09-05 Online:2017-12-26 Published:2017-12-29

摘要/Abstract

摘要： 通过选取若干温度对聚甲基丙烯酸甲酯（PMMA）试样进行应力松弛实验，结合实验数据，建立松弛速率温度（p-T）指数模型，计算不同T下PMMA的p和松弛时间常数（τ）；以积分的形式建立起可连续求解的聚合物松弛应力变化率冷却速率［σΔ（t）-v（t）］模型，求解不同v（t）下聚合物的σΔ（t），同时进行prism微结构类固态热压印实验，通过比较模型计算结果与微结构复制率，验证σΔ（t）-v（t）模型的实用性。结果表明，随着v（t）的提高，σΔ（t）越来越小，内应力松弛的更加充分，微结构的成型精度越高。

Abstract: This paper reported an investigation on the relationship between cooling rate and relaxation rate of poly(methyl methacrylate)(PMMA) during the micro hot embossing process in a solid-like state. A relaxation-rate-temperature index model was established on the basis of the experimental data of stress relaxation of PMMA at different temperature, and then the relaxation rate and relaxation time constants of PMMA at different temperatures were calculated. A relaxation stress ratecooling rate equation was determined for PMMA in an integral form, which could continuously obtain the relaxation stress rate at different cooling rates. A prism microstructural hot embossing experiment was conduced to verify the practicality of stress rate-cooling rate model through the comparison of the theoretical and experimental results. The results indicated that the relaxation stress rate became smaller with an increase of cooling rate, and the internal stress gained a more sufficient relaxation. This led to a higher molding accuracy for the microstructure.

李瑞吴大鸣王琦刘颖孙靖尧曹亚楠. PMMA在类固态微热压印过程中冷却速率与松弛速率的规律分析[J]. 中国塑料, 2017, 31(12): 78-83.

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PMMA在类固态微热压印过程中冷却速率与松弛速率的规律分析

Relationship between Cooling Rate and Relaxation Rate of PMMA During Micro Hot Embossing Process in Solid-like State

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