中国塑料 ›› 2022, Vol. 36 ›› Issue (4): 60-69.DOI: 10.19491/j.issn.1001-9278.2022.04.011

• 加工与应用 • 上一篇    下一篇

自组装单分子层调控界面热输运的研究进展

宋立健1, 张有忱1(), 左夏华1, 张政和1, 安瑛1, 杨卫民1,2, 谭晶1,2, 程礼盛1,2()   

  1. 1.北京化工大学机电工程学院,北京 100029
    2.北京化工大学有机?无机复合材料国家重点实验室,北京 100029
  • 收稿日期:2021-11-08 出版日期:2022-04-26 发布日期:2022-04-24
  • 通讯作者: 程礼盛(1982-),男,副教授,从事高聚物加工成型及微尺度计算,chengls@mail.buct.edu.cn
    张有忱,中共党员,工学博士,教授,博士生导师,从事的研究方向有:机械设计及理论、聚合物加工成型、熔体静电纺丝,zhangyc@mail.buct.edu.cn
    E-mail:zhangyc@mail.buct.edu.cn;chengls@mail.buct.edu.cn

Research progress on interfacial thermal transport controlled by self⁃assembled monolayers

SONG Lijian1, ZHANG Youchen1(), ZUO Xiahua1, ZHANG Zhenghe1, AN Ying1, YANG Weimin1,2, TAN Jing1,2, CHENG Lisheng1,2()   

  1. 1.College of Mechanical and Electrical Engineering,Beijing University of Chemical Technology,Beijing 100029,China
    2.State Key Laboratory of Organic?Inorganic Composites,Beijing University of Chemical Technology,Beijing 100029,China
  • Received:2021-11-08 Online:2022-04-26 Published:2022-04-24
  • Contact: ZHANG Youchen, CHENG Lisheng E-mail:zhangyc@mail.buct.edu.cn;chengls@mail.buct.edu.cn

摘要:

从微观角度出发,综述了自组装单分子层(SAM)在调控软?硬材料界面热输运方面的研究进展,介绍了SAM的传热机理,系统总结了SAM的微观结构对界面热导的影响规律,探讨了SAM的密度、长度、末端官能团等因素对界面热阻或界面热导的影响机理。此外还介绍了目前SAM在聚合物基导热复合材料中的研究,并展望了未来SAM在界面热输运的研究方向。

关键词: 界面热输运, 自组装单分子层, 界面热阻, 界面热导, 聚合物基复合材料

Abstract:

This reviewed the research progress in the heat transfer control of the soft?hard interfaces through self?assembled monolayers (SAM) in the microscopic viewpoint. The heat transfer mechanisms of SAM were introduced and its structure?thermal conductance relations were summarized systematically. The influential factors such as coverage density, length, and terminal functional group of the SAM on the interfacial thermal conductance were discussed. In addition, the current research status of SAM in the polymer?based thermal composites was introduced, and its future research directions of in interfacial heat transfer were prospected.

Key words: interfacial heat transfer, self?assembled monolayer, thermal resistance, thermal conductance, polymer?based composite

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