关键词: 芯片, 封装成型, 翘曲变形机理, 热-流-固耦合

Abstract: In order to predict accurately chip thermal-fluid-structure coupling warpage deformation, based on the Castro-Macosko cure kinetic model, theoretical model describing plastic encapsulation filling process and thermal-fluid-structure coupling warpage deformation formatting process was established, and the formation mechanism of thermal-fluid-structure coupling warpage deformation was revealed. Research results showed that the thermal-fluid-structure coupling warpage of chip increased rapidly at first with increasing melt filling time, after reaching the maximum value decreased gradually and leveled off. The comprehensive thermal-fluid-structure coupling warpage of chips was mainly composed of the thermal-fluid-structure coupling pressure field induced warpage deformation and nonuniform temperature field induced thermal deformation, the thermal-fluid-structure coupling pressure field induced deformation was warping outward, which was proportional to the melt filling unbalance flow length difference and velocity difference of chip up and down surface, explicit first increased and then decreased symmetric parabolic distribution along the axial direction, and was far greater than the nonuniform temperature field induced thermal deformation. The comprehensive thermal-fluid-structure coupling warpage of the chips was mainly controlled by the thermal-fluid-structure coupling pressure field induced deformation.

Key words: chip, plastic encapsulation molding process, warpage deformation mechanism, thermal-fluid-structure coupling