China Plastics ›› 2009, Vol. 23 ›› Issue (08): 35-38 .DOI: 10.19491/j.issn.1001-9278.2009.08.008

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Synthesis of hexaphenoxyl cyclotriphosphazene and its flame retardance on epoxy molding compound for large-scale integrated circuit packaging

YANG Ming-Shan Yang LIU Li-Kai LI Jie DING   

  • Received:2009-04-16 Revised:1900-01-01 Online:2009-08-26 Published:2009-08-26

Abstract: Hexaphenoxyl cyclotriphosphazene (HPCTPZ) was synthesized using titrating technology from a hexachlorocyclotriphosphazene solution, the structure of HPCTPZ was confirmed using FTIR. The obtained HPCTPZ was introduced as a flame retardant into epoxy molding compound(EMC) for packaging of large-scale integrated circuits. The resulted EMC exhibited a flame-retardance rating of UL 94 V0 and an oxygen index of 33.1.

Key words: hexaphenoxyl cyclotriphosphazene, large-scale integrated circuit packaging, epoxy molding compound, halogen-free flame retardance

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