Abstract: Using professional software for mold flow analysis Moldflow/MPI, the filling process of two-color electrical enclosure was simulated. It showed that the optimal locations of both inner and outer enclosure were located at the center of undersurfaces. Air traps trended to occur at the edge of products; main warpage was presented as radial warpage. The filling time, cooling time, maximum injection pressure, and volumetric shrinkage were analyzed and thus optimized the injection process and molding die structure of two-color electrical enclosure.

Key words: electrical enclosure, two-color injection, injection processing simulation