China Plastics ›› 2013, Vol. 27 ›› Issue (11): 89-94.DOI: 10.19491/j.issn.1001-9278.2013.11.017
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Abstract: The optimal gate quantity and location were obtained by a simulation using Moldflow software through a “filling, packing, cooling” scheme. A set of orthogonal experiments was carried out to obtain the optimal injection parameters for minimum warpage including melt temperature, packing time, packing pressure, filling time, and mold temperature. An injection mold was designed based on above simulation and orthogonal experiments and the quality of the parts was improved effectively.
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URL: https://www.plaschina.com.cn/EN/10.19491/j.issn.1001-9278.2013.11.017
https://www.plaschina.com.cn/EN/Y2013/V27/I11/89