Abstract: Aimed at the discoloration and dropping of the colloid for encapsulation of LED beads during the aging process of a lamp, the failure analysis was carried out in this work. The reasons of colloidal failure for LED bead packaging were analyzed by means of slice analysis, X-ray fluoroscopy, infrared spectroscopy, infrared thermal image analysis, and finite element analysis. The results indicated that there was serious discoloration occurred in the colloid close to the chip and the outer surface of lamp beads. The internal structure of the lamp beads is uniform in series, and the failure occurred in silicon resin with the normal sample. It was found that there was no influence of overall heat dissipation performance on the lamp beads. The results from finite element analysis and simulation validation indicated that the failure of packaging silicone resin resulted from the double effects of heat in the LED chip and heat accumulation in the cavity. It was suggested that the lamp support pillar should be opened or directly fabricated into a network structure, which may allow the static air between the reflector and support pillar to flow. Afterward, an optimization process was performed on the basis of the actual situation.