China Plastics ›› 2014, Vol. 28 ›› Issue (12): 93-98.DOI: 10.19491/j.issn.1001-9278.2014.12.019

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Structure and Property of Polypropylene /Waste Printed Circuit Boards Nonmetallic Powder Composites

  

  • Received:2014-05-29 Revised:2014-07-10 Online:2014-12-26 Published:2014-12-26

Abstract: Polypropylene matrix composites was prepared by melt blending which filled with nonmetallic powder from waste printed circuit boards. Changes of crystallization and melting behavior, thermal stability, dynamic mechanical properties and impact fracture surface morphology of composites were analyzed with differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA) and scanning electron microscope analysis(SEM), respectively. The results demonstrate that crystallization rate, crystallinity, thermal stability and storage modulus of composites enhance obviously, while melting point, mechanical loss factor and glass transition temperature decrease slightly. The waste PCB powder are evenly distributed on PP, the interfacial adhesion is better.

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