Optimization of simulation process for injection molding packaging of microelectronic component

doi:10.19491/j.issn.1001-9278.2025.01.008

Abstract

Abstract:

Taking the microelectronic components based on a thermotropic liquid crystal polymer （TLCP） as a research object， the Moldflow analysis software was employed to simulate the injection molding process of the microelectronic components. The effect of different core structures on the injection molding of microelectronic components was compared， and the molding efficiency and molding quality of the microelectronic components in the injection molding process were analyzed. Through comparing the three⁃contact and two⁃contact inlay core structures， the optimal injection molding scheme was determined to be the two⁃contact inlay core structure. The two⁃contact inlay core structure had a filling time of 0.020 4 s， an ejection time of 0.123 5 s， an average volumetric shrinkage rate of 4.414 %， and a comprehensive warpage deformation of 0.011 5 mm. These were determined to be the optimal injection molding scheme for the microelectronic components. The average volume shrinkage and integrated warpage deformation were reduced by 0.149 % and 0.002 7 mm， respectively. Although the two⁃contact inlay core structure showed poorer uniformity in fiber distribution than the three⁃contact one， its volume shrinkage and warpage deformation were reduced due to the concentrated fiber distribution at the edge of the inner core. A comprehensive analysis indicated that the two⁃contact inlay core structure was the optimal scheme for the injection molding of microelectronic components.

Key words: Moldflow, microelectronic component, structure optimization, fiber orientation, warping deformation

CLC Number:

TQ320.66

HU Kunming, WANG Di, JIN Biao, RUAN Jianbo, LIU Wanqiang, XIE Pengcheng. Optimization of simulation process for injection molding packaging of microelectronic component[J]. China Plastics, 2025, 39(1): 44-47.

Figures/Tables 7

Fig.1. Microelectronic component package structure

熔体密度/g·cm^-3	固体密度/g·cm^-3	熔体温度范围/℃	脱模温度/℃	最大剪切应力/MPa	最大剪切速率/s^-1	模具温度范围/℃
1.50	1.62	340~365	244	0.5	60 000	30~140

Tab.1. TLCP fill 30 % Glass Fiber main performance parameters

Fig.2. Microchip package meshing

Fig.3. Stripe and double structure filling time

Fig.4. Stripe and double contact structure ejection temperature time

Fig.5. Stripe and double contact microelectronic components shear rate and core fiber orientation

Fig.6. Stripe and double contact microelectronic components average volume shrinkage and warping deformation

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