Research progress in heat transfer enhancement measures for wall materials of microencapsulated phase change materials

doi:10.19491/j.issn.1001-9278.2022.07.025

Abstract

Abstract:

This paper summarized the research progress in the enhancement of the thermal conductivity of the wall materials from three aspects： the modification of inorganic wall materials （calcium carbonate， titanium dioxide）， inorganic carbon materials （graphene oxide， carbon nanotubes， composite carbon materials）， and nanomaterials （nano alumina， nano titanium dioxide and other nano materials）. The characteristics of each method were analyzed， providing a theoretical guidance for the modification direction and measures of enhancement in the thermal conductivity of microencapsulated PCMs in future.

Key words: microencapsulated phase change material, thermal conductivity, inorganic wall material, carbon material, nanomaterial

CLC Number:

TQ316.6⁺3

ZHANG Qiang, ZHANG Jian, LIN Lin, LIU Jing, WANG Tianhe. Research progress in heat transfer enhancement measures for wall materials of microencapsulated phase change materials[J]. China Plastics, 2022, 36(7): 187-196.

Figures/Tables 9

References 71

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相变储能微胶囊			制备方法	热导率/W·（m·K）^-1	提升率/%	文献
芯材	壁材	属性	制备方法	热导率/W·（m·K）^-1	提升率/%	文献
石蜡	CaCO₃	无机	自组装法	0.846 0	671.43	［18］
石蜡	二氧化硅	无机	界面聚合法	0.701 1	62	［19］
石蜡	MF	有机	原位聚合法	0.111 6	-	［20］
石蜡	UF	有机	原位聚合法	0.223 6	-	［21］
正庚烷	PS	有机	乳液聚合法	0.170 0	-	［22］
正庚烷	CaCO₃	无机	自组装法	1.231 0	368	［23］
正十八烷	PMMA	有机	乳液法	0.192 0	-	［24］
正十八烷	二氧化硅	无机	溶胶⁃凝胶法	0.621 3	313	［25］
正二十烷	TiO₂	无机	乳液模板界面缩聚	0.724 0	350	［26］
正二十烷	二氧化硅	无机	模板法	0.902 0	493	［27］
棕榈酸	氧化铝	无机	溶胶⁃凝胶法	0.530 0	87.94	［28］
油酸⁃聚乙二醇	二氧化硅/氧化锡	无机	原位乳液界面水解和缩聚	0.705 3	282.46	［29］

相变储能微胶囊			制备方法	热导率/W·（m·K）^-1	提升率/%	文献
芯材	壁材	属性	制备方法	热导率/W·（m·K）^-1	提升率/%	文献
石蜡	CaCO₃	无机	自组装法	0.846 0	671.43	［18］
石蜡	二氧化硅	无机	界面聚合法	0.701 1	62	［19］
石蜡	MF	有机	原位聚合法	0.111 6	-	［20］
石蜡	UF	有机	原位聚合法	0.223 6	-	［21］
正庚烷	PS	有机	乳液聚合法	0.170 0	-	［22］
正庚烷	CaCO₃	无机	自组装法	1.231 0	368	［23］
正十八烷	PMMA	有机	乳液法	0.192 0	-	［24］
正十八烷	二氧化硅	无机	溶胶⁃凝胶法	0.621 3	313	［25］
正二十烷	TiO₂	无机	乳液模板界面缩聚	0.724 0	350	［26］
正二十烷	二氧化硅	无机	模板法	0.902 0	493	［27］
棕榈酸	氧化铝	无机	溶胶⁃凝胶法	0.530 0	87.94	［28］
油酸⁃聚乙二醇	二氧化硅/氧化锡	无机	原位乳液界面水解和缩聚	0.705 3	282.46	［29］

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