Abstract: An epoxy resin was chain extended with carboxylcontaining imide, mixed with MeTHPA, an epoxy/imide/anhydride solventless impregnating resin was prepared. The curing technology of the resin was determined using differential scanning calorimetry and the heat resistance of the resin was characterized using thermogravimetric analysis. The storage stability was evaluated through the viscosity change after stored 96 hours at 60 ℃. It was found that anhydride improved the processability and storage stability, and imide enhanced the heat stability.

Key words: solventless impregnated resin, curing temperature, viscosity, heat resistance