Abstract: Taking thermotropic liquid crystal polymer (TLCP) microelectronic components as the research object, the Moldflow analysis software is used to simulate the injection molding process of microelectronic components, to compare the effects of different core structures on the injection molding of microelectronic components, and to analyze the molding efficiency and the molding quality of the microelectronic components in the injection molding process. By comparing the three-contact inlay core structure and two-contact inlay core structure, the best injection molding scheme is two-contact inlay core structure. Two-contact inlay core structure has a filling time of 0.0204s, an ejection time of 0.1235s, an average volumetric shrinkage rate of 4.414%, and a comprehensive warpage deformation of 0.0115mm, which is the best injection molding scheme for microelectronic components. The average volume shrinkage and integrated warpage deformation were reduced by 0.149% and 0.0027 mm, respectively. Although the fiber distribution uniformity in two-contact inlay core structure was poorer compared with three-contact inlay core structure, the volume shrinkage and warpage deformation were reduced thanks to the concentration of fiber distribution at the edge of the inner core, and a comprehensive analysis showed that two-contact inlay core structure was the best scheme for injection molding of microelectronic components.