中国塑料 ›› 2013, Vol. 27 ›› Issue (02): 30-33 .DOI: 10.19491/j.issn.1001-9278.2013.02.006

• 材料与性能 • 上一篇    下一篇

环氧树脂/微粉化双氰胺复合材料制备与性能研究究

郝壮 宁荣昌 明璐 杨卫朋   

  1. 西北工业大学理学院应用化学系
  • 收稿日期:2012-09-17 修回日期:2012-10-26 出版日期:2013-02-26 发布日期:2013-02-26

Study on Preparation and Properties of Epoxy/Resin Micronizeddicyandiamide Composite

  

  • Received:2012-09-17 Revised:2012-10-26 Online:2013-02-26 Published:2013-02-26

摘要: 采用微粉化处理过的双氰胺固化环氧树脂,自制FH1作为促进剂制备出一种可中温固化、具有一定潜伏性的环氧树脂固化体系,通过偏光显微镜对比微粉化前后双氰胺在环氧中的分散状态。结果表明,微粉化双氰胺在环氧树脂中均匀分散且不会沉淀,贮存期可达3个月以上。自制FH1促进剂使得固化反应温度下降40~50 ℃。浇注体冲击强度为56.3 kJ/m2,拉伸强度为91.4 MPa,断裂伸长率为4.6 %,固化体系具有较高的韧性。单向玻纤增强复合材料湿态保持率在70 %以上,树脂与纤维浸润性优异。

关键词: 微粉化双氰胺, 预浸料, 韧性, 湿热性能

Abstract: A latent and mediumtemperature cured epoxy resin system was prepared from epoxy/ micronizeddicyandiamide/FH1. Polarizing microscope revealed that the micronized dicyandiamide could be welldistributed and kept stable in epoxy. The initial curing temperature was decreased about 40~50 ℃compared with that based on nonmicronizeddicyandiamide. The optimal mechanical properties of the resin were flexural strength 56.3 kJ/m2, tensile strength 91.4 MPa, elongation at break 4.6%. For the composites reinforced with fiberglass, the retention rate of mechanical properties at wetting condition was over 70 %.

Key words: micronized dicyandiamide, prepreg, toughness, hot-wet mechanical property