Abstract: In this paper, submicron β-SiC whisker was first treated with a silane coupling agent (KH550) and then introduced into a ternary-bismaleimide system (BDM/ BPA-BMI /DABPA). The tensile and bend moduli of the cured resin were improved effectively and the elongation at break was reduced because of the presence of β-SiC whisker.The impact and fracture toughness of the resin was not changed.With increasing of β-SiC whisker content,the temperature of maximum degration rate of the cured resin increased and the maximum degradation rate decreased.The introduction of β-SiC whisker increased the glass transition temperature (Tg) of cured resin and the maximum Tg value reached 308℃. The thermal stability and heat resistance of the cured resin were improved.