中国塑料 ›› 2011, Vol. 25 ›› Issue (03): 7-12 .DOI: 10.19491/j.issn.1001-9278.2011.03.002

• 综述 • 上一篇    下一篇

导热高分子复合材料研究进展

孔娇月 陈立新 蔡聿峰   

  1. 西北工业大学理学院应用化学系 西北工业大学应用化学系
  • 收稿日期:2010-07-26 修回日期:2010-09-10 出版日期:2011-03-26 发布日期:2011-03-26

Research Development of Thermally Conductive Polymer Composites

KONG Jiao-Yue   

  • Received:2010-07-26 Revised:2010-09-10 Online:2011-03-26 Published:2011-03-26

摘要: 在介绍金属材料、无机非金属材料以及高分子材料导热机理的基础上,介绍了导热填料填充高分子复合材料的导热网链机理和热弹性组合机理2种导热机理,该理论可以解释导热高分子复合材料导热过程中不同的现象和规律;归纳了适用于粒子、纤维等填充的聚合物基复合材料的各种导热模型;讨论了树脂基体、导热填料和温度对干高分子复合材料热导率的影响。

关键词: 导热高分子, 复合材料, 导热机理, 导热模型, 影响因素

Abstract: Based on the general thermal conducting principle of metal,inorganic nonmetallic materials,and polymer materials,two kinds of thermal conducting mechanisms of polymer/heat conductive filler composites were introduced,i.e.,thermal nets chain mechanism and thermalelastic combination mechanism. These mechanisms could explain various phenomena of heat conduction in polymer composites. Some thermal conduction models suitable for fiber and grain filled polymeric composites were presented. Effect of resin,heat conductive filler,and temperature on the thermal conductivity of polymer composites was discussed.

Key words: thermally conductive polymer, composite, thermally conductive mechanism, thermally conductive model, affecting factor