China Plastics ›› 2021, Vol. 35 ›› Issue (7): 12-17.DOI: 10.19491/j.issn.1001-9278.2021.07.002

• Materials and Properties • Previous Articles     Next Articles

Study on Anti⁃thermal Oxidative Aging Mechanism of Polyamide 6/Short⁃cut Carbon Fiber/Copper Salt Composites

LIU Yao, DING Jianfeng, XIA Zhean(), LI Xinxin()   

  1. The Key Laboratory of Specially Functional Polymeric Materials and Related Technology,Ministry of Education,School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China
  • Received:2021-03-08 Online:2021-07-26 Published:2021-07-21

Abstract:

Polyamide 6 (PA6)/short-cut carbon fiber (SCF)/copper salt/potassium(KI) composites were prepared using a melt blending method. The heat-resistant oxidative aging mechanisms of copper salt/KI system for the PA6 composi-tes were studied using electronic universal testing machine, differential scanning calorimetry (DSC), X?ray polycrystalline diffractometer (XRD) and X-ray photoelectron spectrometer (XPS). The results indicated that there is little effect from a single copper salt or KI on the thermal-oxidative aging resistance of PA6. The copper salt/KI compounding system can effectively improve the retention rate of tensile strength for the PA6/SCF composites after heat aging. The carbon fiber has a certain capability to capture free radicals. The addition of copper salt, KI and SCF significantly prolonged the oxidation induction time of PA6. The anti-thermal oxidative aging mechanism of the copper salt/KI system is proposed as follows: firstly, KI converts the divalent copper in the polyamide matrix into monovalent copper, then excessive KI can react with monovalent copper to form Cupric diiodide ion [CuI2-. [CuI2- ions have strong reducibility, which consumes free radicals generated during the aging process of PA6, delaying the thermal degradation process of PA6 accordingly.

Key words: resistance to thermal-oxidative aging, polyamide 6, copper salt, potassium iodide, coordination ion, carbon fiber

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