Abstract: An intrinsically conductive TMBP/DABA thermosetting epoxy resin was prepared by using 3，3’，5，5’-tetramethylbifenol diglycyl ether （TMBP） containing diphenyl mesogenic unit as a raw material and 4， 4-diaminobenzanilide （DABA） containing aromatic amide mesogenic unit （DABA） as a curing agent. The resultant epoxy resin achieved a thermal conductivity as high as 0.33 W/（m·K）. Compared to the conventional bisphenol-A glycidyl ether （DGEBA）/4，4'-diaminodiphenyl methane （DDM） epoxy resin， the as-prepared epoxy resin obtained an increase in thermal conductivity by about 50 %. The out-of-plane and in-plane thermal conductivities of the composites reinforced with 75 wt% short-cut carbon fiber were increased by about 42.7 % and 40.2 %， respectively. The interface bonding strength between the TMBP/DABA matrix resin and short-cut carbon fiber （SCF） or continuous carbon fiber M55J was significantly improved by ultraviolet ozone oxidation method at an optimum modification time of 1 h. The thermal conductivity of the composite was also improved. The SCF/M55J/TMBP/BADA composites were prepared by using intrinsically conductive TMBP/DABA epoxy resin as a matrix resin and SCF and M55J as reinforcement fibers. The addition of SCF can simultaneously improve the thermal conductivities of M55J/TMBP/DABA unidirectional composite plates along the X， Y and Z axes， reaching maximum values of 98.07， 48.23 and 9.40 W/（m·K）， respectively. This work provides a new strategy for improving the comprehensive thermal conductance of composite materials.

Key words: intrinsically conductive epoxy resin, carbon fiber, composite, thermal conductivity