Research progress in diamond thermally conductive composite material

doi:10.19491/j.issn.1001-9278.2024.08.020

Abstract

Abstract:

This paper summarized the mainstream ways of preparing diamond thermally conductive composites， and introduced the preparation process， thermal conductivity mechanism， etc. of each preparation method， including blending method， constructive template method， electrodeposition technology， sintering technology， magnetron sputtering technology， and chemical vapor deposition technology， etc. It outlined the molding process of the different preparation methods and summarized and generalized their thermal conductivity properties. Finally， the studies about diamond thermally conductive composites were summarized and prospected.

Key words: diamond, thermal conductivity, copper base, magnetron sputtering, sintering

CLC Number:

TQ321

TANG Bo, XIANG Lixue, DAI Xumin, WANG Erke, JIANG Tao, WANG Ying, WU Xinfeng. Research progress in diamond thermally conductive composite material[J]. China Plastics, 2024, 38(8): 125-131.

Figures/Tables 11

References 40

1	Chen Hongyun， Xiang Wang， Dong Xiaoyan， et al. Adjusting the energy⁃storage characteristics of 0.95NaNbO₃⁃0.05Bi（Mg_0.5Sn_0.5）O₃ ceramics by doping linear perovskite materials［J］. ACS Applied Materials & Interfaces， 2022， 14 （22）：25 609⁃25 619.
2	肖琰，魏伯荣，杨海涛，等.导热高分子材料的研究开发现状［J］.中国塑料，2005（04）：12⁃16.
	XIAO Y， WEI B R， YANG H T，et al. Current status of research and development of thermally conductive polymer materials［J］. China Plastics， 2005（04）：12⁃16.
3	Santosh Kumar Sahoo， Mihir Kumar Das， Rath Prasenjit. Application of TCE⁃PCM based heat sinks for cooling of electronic components： A review［J］. Renewable and Sustainable Energy Reviews， 2016， 59：550⁃582.
4	Zhou Lianggong， Liu Jianan， Ding Ruiqing， et al. A review of diamond interfacial modification and its effect on the properties of diamond/Cu matrix composites［J］. Surfaces and Interfaces， 2023， 40：103143.
5	Zhu P， Wang P， Shao P， et al. Research progress in interface modification and thermal conduction behavior of diamond/metal composites［J］. Int J Miner Metall Mater， 2022， 29：200⁃211.
6	Li Zhang， Hua Deng， Qiang Fu. Recent progress on thermal conductive and electrical insulating polymer composites［J］. Composites Communications， 2018， 8：74⁃82.
7	Bhoi N K， Singh H， Pratap S. Developments in the aluminum metal matrix composites reinforced by micro/nano particles⁃A review［J］. Journal of Composite Materials， 2020， 54（6）：813⁃833.
8	Ning Li， Zhang Yongjian， Yang Zhang， et al. Realizing ultrahigh thermal conductivity in bimodal⁃diamond/Al composites via interface engineering［J］. Materials Today Physics， 2022， 28：100901.
9	Liu Weina， Naydenov Boris， Chakrabortty Sabyasachi， et al. Fluorescent nanodiamond⁃gold hybrid particles for multimodal optical and electron microscopy cellular imaging［J］. Nano Letters， 2016， 16（10）：6 236⁃6 244.
10	Inyushkin A V， Taldenkov A N， Yelisseyev A P， et al. Thermal conductivity of type⁃Ib HPHT synthetic diamond irradiated with electrons［J］. Diamond and Related Materials， 2023， 139：110302.
11	Liu Yiling， Lin Qiu， Liu Jinlong， et al. Enhancing thermal transport across diamond/graphene heterostructure interface［J］. International Journal of Heat and Mass Transfer， 2023， 209：124123.
12	Xie Zhongnan， Hong Guo， Zhen Zhang， et al. Thermal expansion behaviour and dimensional stability of Diamond/Cu composites with different diamond content［J］. Journal of Alloys and Compounds， 2019， 797：122⁃130.
13	Zhao Y， Yan F， Liu X， et al. Thermal transport properties of diamond phonons by electric field［［J］. Nanomaterials， 2022， 12（19）：3399.
14	Dong Huicong， Wen Bin， Yuwen Zhang， et al. Thermal conductivity of diamond/SiC nano⁃polycrystalline composites and phonon scattering at interfaces［J］. ACS Omega， 2017， 2 （5）：2 344⁃2 350.
15	杨碧环，李东皓，祝捷，等.缺陷增强铜/金刚石界面热导的分子动力学研究［J］.工程热物理学报，2023，44（03）：781⁃786.
	YANG B H， LI D H， ZHU J， et al. Molecular dynamics study of thermal conductivity at defect⁃enhanced copper/diamond interfaces［J］. Journal of Engineering Thermophysics， 2023， 44（03）：781⁃786.
16	Cao Zhenya， Chen Shuai， Jiang Zhizhong， et al. Effect of Si⁃coated diamond on the relative density and thermal conductivity of diamond/W composites prepared by SPS［J］. Vacuum， 2023， 209：111728.
17	Jia S Q， Yang F. High thermal conductive copper/diamond composites： state of the art［J］. J Mater Sci， 2021， 56：2 241⁃2 274.
18	Zhao B， Jiang G. Thermal conductive epoxy enhanced by nanodiamond⁃coated carbon nanotubes［J］. Electron Mater Lett， 2017， 13：512⁃517.
19	Zeng Chengzong， Ma Chaofan， Shen Jun. High thermal conductivity in diamond induced carbon fiber⁃liquid metal mixtures［J］. Composites Part B： Engineering， 2022， 238：109902.
20	Du Xinxin， Yang Wulin， Zhu Jiajun， et al. Aligning diamond particles inside BN honeycomb for significantly improving thermal conductivity of epoxy composite［J］. Composites Science and Technology， 2022， 222：109370.
21	Liu Pengfei， He Xinbo， Qu Xuanhui. Preparation of high thermal conductivity diamond/SiC composites with 3D connected diamond at low volume fraction［J］. Composites Communications， 2023， 39：101526.
22	Yoshitomi Tomohiro， Matsumoto Takuya， Nishino Takashi. Highly thermally conductive nanocomposites prepared by the ice⁃templating alignment of nanodiamonds in the thickness direction［J］. ACS Applied Polymer Materials， 2023， 5（10）：8 349⁃8 358.
23	Long Zhang， Zhou Kechao， Wei Quiping， et al. Thermal conductivity enhancement of phase change materials with 3D porous diamond foam for thermal energy storage［J］.Applied Energy， 2019， 233：208⁃219.
24	Long Zhang， Wei Qiuping， An Junjie， et al. Construction of 3D interconnected diamond networks in Al⁃matrix composite for high⁃efficiency thermal management［J］. Chemical Engineering Journal， 2020， 380：122551.
25	Jun Cho Hai， Kim Young⁃June， Erb Uwe. Thermal conductivity of copper⁃diamond composite materials produced by electrodeposition and the effect of TiC coatings on diamond particles［J］. Composites Part B： Engineering， 2018， 155：197⁃203.
26	Hagio Takeshi， Park Jae⁃Hyeok， Naruse Yuto， et al. Electrodeposition of nano⁃diamond/copper composite platings： Improved interfacial adhesion between diamond and copper via formation of silicon carbide on diamond surface［J］. Surface and Coatings Technology， 2020， 403： 126322.
27	Wu Yongpeng， Luo Jiangbo， Yan Wang， et al. Critical effect and enhanced thermal conductivity of Cu⁃diamond composites reinforced with various diamond prepared by composite electroplating［J］. Ceramics International， 2019， 10（45）：13 225⁃13 234.
28	Arai S， Ueda M. Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions［J］. J Appl Electrochem， 2020， 50：631⁃638.
29	Ishida Naoya， Kato Kazuki， Suzuki Norihiro， et al. Preparation of amino group functionalized diamond using photocatalyst and thermal conductivity of diamond/copper composite by electroplating［J］. Diamond and Related Materials， 2021， 118：108509.
30	Wu Dandan， Wang Chengyong， Hu Xiaoyue， et al. Fabrication and characterization of highly thermal conductive Si3N4/diamond composite materials［J］. Materials & Design， 2023， 225：111482.
31	Jhong Yu⁃Siang， Tseng Hsiao⁃Ting， Lin Su⁃Jien. Diamond/Ag⁃Ti composites with high thermal conductivity and excellent thermal cycling performance fabricated by pressureless sintering［J］. Journal of Alloys and Compounds， 2019， 801：589⁃595.
32	Lu Kaijie， Wang Chunju， Wang Changrui， et al. Study of the hot⁃pressing sintering process of diamond/copper composites and their thermal conductivity［J］. Journal of Alloys and Compounds， 2023， 960：170608.
33	Wang X， He X， Xu Z， et al. Preparation of W⁃plated diamond and improvement of thermal conductivity of diamond⁃WC⁃Cu composite［J］. Metals， 2021， 11（3）：437.
34	Liu Xiaoyan， Sun Fangyuan， Wang Luhua， et al. The role of Cr interlayer in determining interfacial thermal conductance between Cu and diamond［J］. Applied Surface Science， 2020， 515：146046.
35	Yang Wenshu， Chen Guoqin， Wang Pingping， et al. Enhanced thermal conductivity in Diamond/Aluminum composites with tungsten coatings on diamond particles prepared by magnetron sputtering method［J］. Journal of Alloys and Compounds， 2017， 726：623⁃631.
36	Jia Jinhao， Bai Shuxin， Xiong Degan， et al. Enhanced thermal conductivity in diamond/copper composites with tungsten coatings on diamond particles prepared by magnetron sputtering method［J］. Materials Chemistry and Physics， 2020， 252：123422.
37	Liu Ruxia， Luo Guoqiang， Yuan Li， et al. Microstructure and thermal properties of diamond/copper composites with Mo2C in⁃situ nano⁃coating［J］. Surface and Coatings Technology， 2019， 360：376⁃381.
38	Wei S， Yu Z F， Zhou L J， et al. Investigation on enhancing the thermal conductance of gallium⁃based thermal interface materials using chromium⁃coated diamond particles［J］. J Mater Sci： Mater Electron， 2019， 30：7 194⁃7 120.
39	Jiao Zengkai， Li Songbo， Zhou Kechao， et al. Application of multi⁃scale pore regulation for high thermal conductivity foam reinforcements in energy storage［J］. Composites Part A： Applied Science and Manufacturing， 2022， 157：106938.
40	Ye Wentao， Wei Qiuping， Long Zhang， et al. Macroporous diamond foam： A novel design of 3D interconnected heat conduction network for thermal management［J］. Materials & Design， 2018， 156：32⁃41.

材料	填料含量	热导率/ W·mK^-1	参考文献
环氧树脂/金刚石/ 氮化硼	金刚石（12 %）；氮化硼（7 %）	2.72	［20］
碳化硅/金刚石	金刚石（26 %）	298	［21］
环氧树脂/纳米金刚石	纳米金刚石（4.63 %）	1.27	［22］
石蜡/金刚石泡沫	金刚石（1.3 %）	6.7	［23］
铝/金刚石	金刚石（4.6 %）	315.7	［24］

材料	填料含量	热导率/ W·mK^-1	参考文献
环氧树脂/金刚石/ 氮化硼	金刚石（12 %）；氮化硼（7 %）	2.72	［20］
碳化硅/金刚石	金刚石（26 %）	298	［21］
环氧树脂/纳米金刚石	纳米金刚石（4.63 %）	1.27	［22］
石蜡/金刚石泡沫	金刚石（1.3 %）	6.7	［23］
铝/金刚石	金刚石（4.6 %）	315.7	［24］

材料	填料含量	热导率/ W·mK^-1	参考文献
碳化钛/金刚石/铜	金刚石（68.2 %）	454	［25］
铜/碳化硅包裹纳米金刚石	金刚石（2.72 %）	46	［26］
铜/400 μm金刚石	金刚石（60.6 %）	847	［27］
铜/230 μm金刚石	金刚石（49 %）	600	［28］
铜/氨基化微米金刚石	金刚石（20.3 %）	595	［29］

材料	填料含量	热导率/ W·mK^-1	参考文献
碳化钛/金刚石/铜	金刚石（68.2 %）	454	［25］
铜/碳化硅包裹纳米金刚石	金刚石（2.72 %）	46	［26］
铜/400 μm金刚石	金刚石（60.6 %）	847	［27］
铜/230 μm金刚石	金刚石（49 %）	600	［28］
铜/氨基化微米金刚石	金刚石（20.3 %）	595	［29］

材料	填料含量	热导率/ W·mK^-1	参考文献
Si₃N₄/金刚石	金刚石（50 %）	202	［30］
银⁃钛/金刚石	金刚石/银（60 %）；钛（1.5 %）	953	［31］
铜/金刚石	金刚石（60 %）	564	［32］
铜/镀钨金刚石	金刚石（60 %）	874	［33］