Effect of the Ratio of Si—H/C=C of Organosilicone Resin Materials for Large-power LED Packaging on Curing Behavior

doi:10.19491/j.issn.1001-9278.2015.09.007

China Plastics ›› 2015, Vol. 29 ›› Issue (09): 32-37 .DOI: 10.19491/j.issn.1001-9278.2015.09.007

Effect of the Ratio of Si—H/C=C of Organosilicone Resin Materials for Large-power LED Packaging on Curing Behavior

Received:2015-03-10 Revised:2015-05-05 Online:2015-09-26 Published:2015-09-26

Abstract

Abstract: A organosilicone resin for largepower LED packaging was prepared through Si—H addition reaction of hydrogensilicone with vinylsilicone catalyzed by Pt coordination compound in this paper, and the effect of the ratio of Si—H/C=C on curing behavior of the organosilicones was investigated by nonisothermal DSC method. It was found that when the ratio of Si—H/C=C was 1.6, the curing temperature was the lowest. After the process for vacuum deaeration the curing temperature program was 80 ℃ for 1h and then 95 ℃ for 2 h.

Key words: light emitting diodes, packaging, organosilicone resin, curing kinetics

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Effect of the Ratio of Si—H/C=C of Organosilicone Resin Materials for Large-power LED Packaging on Curing Behavior

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