China Plastics ›› 2023, Vol. 37 ›› Issue (10): 56-62.DOI: 10.19491/j.issn.1001-9278.2023.10.008

• Processing and Application • Previous Articles     Next Articles

Study on performance and thermal conduction simulation of highly thermally conductive polyoxymethylene composite materials

XIAO Weigen, LONG Chunguang(), WANG Ke, MIN Jianxin   

  1. School of Automobile and Mechanical Engineering,Changsha University of Science and Technology,Changsha 410004,China
  • Received:2023-05-16 Online:2023-10-26 Published:2023-10-23

Abstract:

To address the poor thermal conduction issue of polyoxymethylene (POM), copper fiber (COF) and basalt fiber (BF) were added to POM to prepare POM/COF and POM/COF/BF composites through an extrusion⁃injection molding process. The influence of COF on the thermal conductivity of POM was verified using the ABAQUS software. The results indicated that the addition of copper fiber increased the thermal conductivity of POM up to 0.39 W/mK. The mechanical test results indicated that the incorporation of COF increased the stiffness of POM slightly but reduced its tensile strength. The thermal conductivity of POM/COF composite increased with an increase in the BF content and reached a maximum of around 0.5 W/mK at a BF content of 15 wt%, which was approximately 50 % higher than that of pure POM. Meanwhile, the addition of BF increased the stiffness of POM significantly, resulting in a maximum increase by about 200 %. Through steady⁃state thermal conduction simulation using the ABAQUS software, the composite containing copper fiber was found to obtain a lower surface temperature. This may be because the heat flow was more easily transferred to the low⁃temperature area through the fibers.

Key words: polyoxymethylene, copper fiber, basalt fiber

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