Study on laser direct structuring materials based on polyamide 6 and polycarbonate and their fabrication of parts with heterostructure

doi:10.19491/j.issn.1001-9278.2022.02.002

Abstract

Abstract:

A series of laser direct structuring （LDS） alloys based on polyamide 6 （PA6）， polycarbonate （PC） and their composite materials were prepared using a melt extrusion method. The thermal properties， solvent resistance， and mechanical properties of the LDS alloys were characterized， and their fracture mechanism was investigated. The reliability and safety of the resultant materials used for the manufacture of mobile phone components was also verified. The results indicated that the LDS alloys had special thermal properties and rheological behaviors. The PA6 component improved the solvent resistance of the alloys， while the PC component increased the heat resistance of the alloys. With an increase in the PA6 content， the notched impact strength， elongation at break， tensile strength and modulus， flexural strength and modulus of the LDS alloy all decreased at first and then increased. The LDS alloy with pure PC showed a ductile fracture， whose fracture mechanism was attributed to the formation of shear bands resulting from the external force and network structures. The LDS alloys with pure PA6 and PC/PA6 exhibited a brittle fracture， and their corresponding fracture mechanism was ascribed to the formation of a “sea?island” structure based on two phases， crazing caused by shearing fracture， and cavitation effect. The LDS alloys had excellent laser activation and electroless plating functions， and the copper/nickel plating layer displayed high reliability and safety. The alloys developed in this study were suitable for manufacturing the circuits of devices with a heterostructure.

Key words: laser direct structuring, polyamide 6, polycarbonate, fracture mechanism, heterostructure circuit

CLC Number:

TQ327.8

YU Zhixing, LI Yingcheng, WANG Hongxue, PANG Xinlei, WANG Yuyao. Study on laser direct structuring materials based on polyamide 6 and polycarbonate and their fabrication of parts with heterostructure[J]. China Plastics, 2022, 36(2): 8-12.

Figures/Tables 8

References 17

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LDS 合金	结晶温度/ ^oC	熔融焓/ J·g^-1	结晶度/ %	T/^oC	耐溶剂性	MFR/ g·（10 min）^-1
A	—	—	—	111	差	25.0
B	164	7.7	20.2	93	差	7.4
C	172	19.0	24.9	85	良	0.2
D	173	32.2	28.2	57	优	2.3
E	185	52.0	30.3	51	优	9.6

LDS 合金	结晶温度/ ^oC	熔融焓/ J·g^-1	结晶度/ %	T/^oC	耐溶剂性	MFR/ g·（10 min）^-1
A	—	—	—	111	差	25.0
B	164	7.7	20.2	93	差	7.4
C	172	19.0	24.9	85	良	0.2
D	173	32.2	28.2	57	优	2.3
E	185	52.0	30.3	51	优	9.6

LDS合金	缺口冲击强度/J·m^-1	断裂伸长率/%	拉伸强度/MPa	拉伸模量/MPa	弯曲强度/MPa	弯曲模量/MPa
A	407.5±30.5	72.6±5.9	52.0±0.9	1 971±9	84.8±0.6	2 121±11
B	47.2±3.9	9.8±0.6	32.4±0.7	1 546±6	54.9±0.9	1 436±5
C	10.5±1.1	1.6±0.2	29.3±0.2	2 100±12	63.0±0.4	1 818±7
D	27.0±2.3	2.6±0.5	40.2±0.5	2 318±8	69.8±0.1	1 956±3
E	152.9±8.6	58.8±1.1	49.9±0.1	2 155±14	71.9±1.1	1 893±14

LDS合金	缺口冲击强度/J·m^-1	断裂伸长率/%	拉伸强度/MPa	拉伸模量/MPa	弯曲强度/MPa	弯曲模量/MPa
A	407.5±30.5	72.6±5.9	52.0±0.9	1 971±9	84.8±0.6	2 121±11
B	47.2±3.9	9.8±0.6	32.4±0.7	1 546±6	54.9±0.9	1 436±5
C	10.5±1.1	1.6±0.2	29.3±0.2	2 100±12	63.0±0.4	1 818±7
D	27.0±2.3	2.6±0.5	40.2±0.5	2 318±8	69.8±0.1	1 956±3
E	152.9±8.6	58.8±1.1	49.9±0.1	2 155±14	71.9±1.1	1 893±14

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