中国塑料 ›› 2015, Vol. 29 ›› Issue (07): 13-15 .DOI: 10.19491/j.issn.1001-9278.2015.07.003

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高导热填充型环氧树脂复合材料研究进展

王唯贻,杨彪   

  1. 北京工商大学
  • 收稿日期:2015-04-17 修回日期:2015-12-31 出版日期:2015-07-26 发布日期:2015-07-26

Advanced Progress of High Thermally Conductive Filled Epoxy Composites

  • Received:2015-04-17 Revised:2015-12-31 Online:2015-07-26 Published:2015-07-26

摘要: 对填充型环氧树脂基高导热材料的最新研究进展进行了总结,从导热机理、新型导热填料、构建完善有效的导热网络以及填料与环氧基体间界面层结构设计等方面进行了分析,提出了该研究领域的技术关键点和发展趋势。

关键词: 环氧树脂, 高导热, 导热填料, 界面层, 导热网络

Abstract: The latest approaches to filled epoxy composites with high thermal conductivity were reviewed. The mechanism of thermal conduction, new type of thermal conductive fillers and the construction of the effective heat conducting network, as well as the design of interface layer between fillers and epoxy matrix were analyzed. Besides, the key techniques and hot research topics of high thermally conductive epoxy composites were summarized.

Key words: epoxy resin, high thermal conductivity, thermal conductive fillers, interface layer, thermally conductive network