中国塑料 ›› 2022, Vol. 36 ›› Issue (3): 48-52.DOI: 10.19491/j.issn.1001-9278.2022.03.008

• 材料与性能 • 上一篇    下一篇

高温缩聚法制备高透明性聚酰亚胺薄膜

卢春燕1,2(), 王刚1,2, 刘帅1,2, 朱天容2, 刘芸2, 汪海平2, 胡思前1,2()   

  1. 1.江汉大学光电化学材料与器件教育部重点实验室,武汉 430056
    2.江汉大学光电材料与技术学院,武汉 430056
  • 收稿日期:2021-11-23 出版日期:2022-03-26 发布日期:2022-03-25
  • 通讯作者: 胡思前(1963—),男,教授、硕导,研究方向为功能材料,husiqian@126.com
    E-mail:1425148755@qq.com;husiqian@126.com
  • 作者简介:卢春燕(1995—),女,硕士研究生,研究方向为功能材料,1425148755@qq.com
  • 基金资助:
    国家高技术研究发展计划(“863”项目)(2015AA033406);武汉市人才培养计划(20141822);光电化学材料与器件教育部重点实验室开放基金(江汉大学)(JDGD?201711)

Preparation of high⁃transparency polyimide film by high⁃temperature polycondensation method

LU Chunyan1,2(), WANG Gang1,2, LIU Shuai1,2, ZHU Tianrong2, LIU Yun2, WANG Haiping2, HU Siqian1,2()   

  1. 1.Key Laboratory of Optoelectronic Chemical Materials and Devices,Ministry of Education,Jianghan University,Wuhan 430056,China
    2.School of Optoelectronic Materials and Technology,Jianghan University,Wuhan 430056,China
  • Received:2021-11-23 Online:2022-03-26 Published:2022-03-25
  • Contact: HU Siqian E-mail:1425148755@qq.com;husiqian@126.com

摘要:

以不同摩尔比的二胺单体1,3?双(4’?氨基苯氧基)苯(TPE?R)、2,6?二氨基甲苯(2,6?DAT)和二酐单体4,4’?氧双邻苯二甲酸酐(ODPA)为原料进行三元聚合,采用高温熔融缩聚法合成了一系列聚酰亚胺(PI)薄膜。通过红外、紫外光谱仪、差示扫描量热仪、热重分析仪等表征与测试了PI薄膜的微观结构、光学性能、热稳定性及溶解度等。结果表明,合成的模塑粉和薄膜已经亚胺化完全,薄膜的最大透过率均在80 %以上,玻璃化转变温度最高接近290 ℃,800 ℃时残炭率均在55 %以上;合成的所有模塑粉均能完全溶解在常见有机溶剂N,N?二甲基乙酰胺(DMAc)、N?甲基吡咯烷酮(NMP)、N,N?二甲基甲酰胺(DMF)和二氯甲烷(DCM)中。

关键词: 聚酰亚胺, 高温缩聚法, 三元聚合, 模塑粉, 薄膜

Abstract:

A series of polyimide (PI) films were synthesized through high?temperature melt polycondensation with different mole ratio of diamine monomer 1,3?bis(4?aminophenoxy)benzene, 2,6?diaminotoluene (2,6?DAT) and dianhydride monomer 4,4'?oxydiphthalic anhydride. The resulting PI products were characterized with infrared spectroscopy, UV?vis spectroscopy, DSC, TGA, and solubility test. The results show that the obtained PI molding powders and films were imidized completely, and the resulant PI films exhibited maximum transmittance of more than 80 %, a maximum glass transition temperature of approximately 290 ℃, and a residual carbon yield of more than 55 wt% at 800 ℃. Almost all molding powders were dissolved completely in normal organic solvents like N,N?dimethylacetamide, N?methylpyrroli?done, N,N?dimethylformamide, and dichloromethane.

Key words: polyimide, high?temperature melt polycondensation, ternary polymerization, molding powder, film

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