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中国塑料 ›› 2021, Vol. 35 ›› Issue (3): 130-138.DOI: 10.19491/j.issn.1001-9278.2021.03.018
收稿日期:
2020-07-18
出版日期:
2021-03-26
发布日期:
2021-03-22
基金资助:
LUO Xuanang, LIU Shumei(), ZHAO Jianqing
Received:
2020-07-18
Online:
2021-03-26
Published:
2021-03-22
Contact:
LIU Shumei
E-mail:liusm@scut.edu.cn
摘要:
物联网(IoT)和第五代移动通信技术(5G技术)的飞速发展,对封装材料和元器件基材的介电性能提出了更高的要求,开发具备低介电常数以及低介电损耗的环氧树脂(EP)成为重要的研究方向。本文从原料、固化条件、填料、共混共聚和层状复合等几个方面对制备低介电损耗环氧复合材料的方法进行了综述,同时简要分析了各种研究方案获得低介电损耗的主要原因,最后例举了低介电环氧树脂目前仍存在的一些问题,并对未来的研究方向进行了展望。
中图分类号:
罗轩昂, 刘述梅, 赵建青. 低介电损耗环氧树脂复合材料的研究进展[J]. 中国塑料, 2021, 35(3): 130-138.
LUO Xuanang, LIU Shumei, ZHAO Jianqing. Research Progress in Low Dielectric Loss Epoxy Resin Composites[J]. China Plastics, 2021, 35(3): 130-138.
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