China Plastics ›› 2022, Vol. 36 ›› Issue (2): 75-81.DOI: 10.19491/j.issn.1001-9278.2022.02.012

• Processing and Application • Previous Articles     Next Articles

Curing kinetics and properties of gallic acid epoxy resin/ricinoleic acid⁃based polyamine thermosetting system

LIU Zhen, YU Yun, ZHANG Menghang, YIN Liuye, DUAN Yufei, HOU Guixiang()   

  1. Tangshan Key Laboratory of Functional Polymer Materials,College of Materials Science and Engineering,North China University of Science and Technology,Tangshan 063210,China
  • Received:2021-09-23 Online:2022-02-26 Published:2022-02-23

Abstract:

Ricinoleic acid?based polyamine (COAPA) was synthesized as a curing agent using castor oil and three ethyle?ne four amine as raw materials and then was mixed with gallic acid epoxy resin (GAER) to form a whole biological cu?ring system. The curing process of GAER/COAPA composite system was investigated using a nonisothermal DSC method. The optimum mass ratio of GAER to COAPA was determined to be 7:3 for the curing system, and the optimum curing temperatures were obtained. The activation energy and kinetic parameters of curing reaction were obtained by fitting and calculation using the Kissinger equation together with the ?esták?Berggren autocatalytic model. The pro?perties of the cured GAER system were compared with that of the bisphenol?A epoxy cured system. The results indica?ted that the average activation energy of the GAER/COAPA system was 62.28 kJ/mol. When the conversion rate of cu?ring reaction was less than 60 %, the curing kinetics conformed to the ?esták?Berggren autocatalytic model. Compared to the bisphenol?A epoxy thermoset, the gallic acid epoxy thermoset exhibited a lower thermal decomposition temperature and a higher carbon residue rate at 800 ℃, and its tensile strength and flexural modulus were lower, the flexural strength and glass transition temperature were also slightly higher.

Key words: gallic acid epoxy resin, castor oil polyamine, curing kinetics, nonisothermal differential scanning calorimetry, property

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