Abstract: Microcapsules with polysulfone (PSF) as the shell material and bisphenyl A epoxy resin as the core substance were fabricated by solvent evaporation method. The size distribution, surface morphology, and thermal properties of the microcapsules were investigated by means of laser particle size analyzer, optical microscope, and microcomputer differential thermal balance. Meanwhile, the influence of kind and dosage of dispersants, stirring rate, reaction temperature, and the mass ratio of wall to core materials on the preparation of microcapsules were discussed. It showed that higher reaction temperature was not beneficial to the encapsulation. When the concentration of PVA as the dispersion agent was 1.0 wt %, the stirring rate was 750 r/min, the reaction temperature was about 30 ℃, and the ratio of wall/core mass ratio was 2∶1, the microcapsules had an average diameter less than 100 μm, and were endowed with excellent sphericity and high yields.