Study on the Properties of the Epoxy Resin/Novolac System Modified by Phosphorus containing Organosiloxane

doi:10.19491/j.issn.1001-9278.2010.02.008

China Plastics ›› 2010, Vol. 24 ›› Issue (02): 42-46 .DOI: 10.19491/j.issn.1001-9278.2010.02.008

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Study on the Properties of the Epoxy Resin/Novolac System Modified by Phosphorus containing Organosiloxane

LIU Wei-Qu

Received:2009-09-23 Revised:2009-10-29 Online:2010-02-26 Published:2010-02-26

Abstract

Abstract: A phosphorus containing organosiloxane (GPTMS-DEP) was prepared using silane coupling agent and DEP, which was used as a modifier in epoxy systems. The flame retardancy of the modified epoxy resin reached 30 %. The glass transition temperatures (Tg) was 157 ℃, 45 ℃ higher than that of the neat system. The residual char yield under 720℃ and the temperature of 50 % weight loss increased obviously. SEM showed that GPTMS-DEP and epoxy resin was compatible when the content of GPTMS-DEP was below 20 %.

Key words: epoxy resin, organsilicon containing phosphorus, flame retardancy, thermal behavior

LIU Wei-Qu . Study on the Properties of the Epoxy Resin/Novolac System Modified by Phosphorus containing Organosiloxane[J]. China Plastics, 2010, 24(02): 42-46 .

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Study on the Properties of the Epoxy Resin/Novolac System Modified by Phosphorus containing Organosiloxane

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