A Self⁃healing Epoxy Cured with Anhydride at Middle and High Temperatures

doi:10.19491/j.issn.1001-9278.2021.11.003

Abstract

Abstract:

In light of the microencapsulated epoxy-amine self?healing system with high healing performance， good compati-bility， and relatively good thermal stability， this paper developed a self?healing commercial epoxy resin cured with anhydride at middle and high temperatures ranging from 100 to 170 ℃. The thermal stabilities of the epoxy and amine as healants were extensively evaluated before and after microencapsulating them in the resin matrix. The compatibility of the cured healants with the anhydride?cured epoxy was quantitatively characterized through in?situ injecting the pre-mixed healants into the cracked pure epoxy resin. The self?healing anhydride-cured epoxy using dual?component microcapsule system containing the selected healants was formulated， and the effects of the ratio and concentration of the dual?component microcapsules and the curing procedure of the host matrix on its healing performance was systematically. The results indicated that the selected healants exhibited good thermal stability， especially after microencapsulated and embedded into the host matrix. Owing to the good compatibility between the selected healants and resin matrix as confirmed by the manually injection healing， the self?healing showed good healing performance when epoxy cured with anhydride at middle and high temperatures through the microencapsulated epoxy?amine system. Healing efficiency of over 80 % could be achieved after the parametric optimization.

Key words: acid anhydride, epoxy resin, microcapsule, self?healing

CLC Number:

TQ 323.5

YANG Zhitao, FANG Xinglei, LAI Shaochuan, XIONG Daoying, WANG Yao, ZHANG Chen, HE Hezhi, ZHANG He. A Self⁃healing Epoxy Cured with Anhydride at Middle and High Temperatures[J]. China Plastics, 2021, 35(11): 15-23.

Figures/Tables 10

Fig.1. Schematic diagram of the structure of the used TDCB specimen

微胶囊比例（环氧：胺类）	微胶囊总含量/%	固化程序
2∶1	10.0	T100/3h?T130/2h
3∶2	10.0	T100/3h?T130/2h
1∶1	10.0	T100/3h?T130/2h
2∶3	10.0	T100/3h?T130/2h
1∶2	10.0	T100/3h?T130/2h
1∶1	5.0	T100/3h?T130/2h
1∶1	7.5	T100/3h?T130/2h
1∶1	10.0	T100/3h?T130/2h
1∶1	12.5	T100/3h?T130/2h
1∶1	15.0	T100/3h?T130/2h
1∶1	10.0	T100/3h
1∶1	10.0	T100/3h?T130/2h
1∶1	10.0	T100/3h?T130/2h?T170/3h

Tab.1. Process parameters used in the preparation of self?healing samples

Fig.2. TG curves of the samples

Fig.3. TG curves of the samples

Fig.4. SEM of the samples

Fig.5. Optical microscopic images of the dual microcapsules in the Epotech epoxy matrix after different heat treatment

Fig.6. Weight loss of the core liquids of both epoxy microcapsules and amine microcapsules in the Epotech epoxy resin

Fig.7. Typical load?displacement curves of the pure Epotech resin TDCB specimen before and after the manual healing， and influence of the curing procedure on the healing efficiency by manual healing

Fig.8. Influence of process parameters on properties of self?healing samples

Fig.9. SEM of the crack surfaces of Epotech TDCB self?healing specimen after the healing test

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