中国塑料 ›› 2025, Vol. 39 ›› Issue (7): 32-43.DOI: 10.19491/j.issn.1001-9278.2025.07.007

• 材料与性能 • 上一篇    下一篇

黏弹性可调控强粘接热塑性淀粉基热熔胶

李满林1, 阎宇2, 高兵兵2, 胡赞军1, 张水洞2()   

  1. 1.广东泰强新材料科技有限公司,广东省高性能环保胶粘剂(泰强科技)工程技术研究中心,广东 清远 513042
    2.华南理工大学机械与汽车工程学院,华南理工大学前沿弹性体研究院 广州 510640
  • 收稿日期:2024-12-02 出版日期:2025-07-26 发布日期:2025-07-22
  • 通讯作者: 张水洞(1977-),教授,研究方向为高分子材料绿色阻燃、加工新原理和新方法的研究,starch@scut.edu.cn
    E-mail:starch@scut.edu.cn

Structure and properties of high⁃adhesion thermoplastic starch⁃based hot melt adhesive with controllable viscoelasticity

LI Manlin1, YAN Yu2, GAO Bingbing2, HU Zanjun1, ZHANG Shuidong2()   

  1. 1.Guangdong Taiqiang New Materials Technology Co,Ltd,Guangdong High Performance Environmental Protection Adhesive (Taiqiang Technology) Engineering Technology Research Center,Qingyuan 513042,China
    2.School of Mechanical and Automotive Engineering,South China University of Technology,Emergent Elastomer Institute,Guangzhou 510640,China
  • Received:2024-12-02 Online:2025-07-26 Published:2025-07-22
  • Contact: ZHANG Shuidong E-mail:starch@scut.edu.cn

摘要:

采用两步法制备了基于酒石酸改性热塑性淀粉(TPSTA1)的高粘接强度热熔胶,通过添加乙烯⁃醋酸乙烯共聚物(EVA)、松香和铝粉,并利用密炼共混工艺,系统研究了不同含量的EVA、松香和铝粉对热熔胶流动性、黏附能力、黏弹性和相容性的影响。结果表明,随着EVA和松香的混合物(HMA)和铝粉含量的变化,样品的粘接强度、流动性和表面能均呈现先升后降的趋势。优化配方后,铜片、铝箔和无纺布的粘接强度显著提升。此外,HMA和铝粉的加入破坏了TPSTA1的氢键网络,增加了分子链的运动性,使胶体黏弹性转向黏性,增强了粘接体系的稳定性。微观结构分析显示,在高HMA含量下,TPSTA1与松香的相容性较差,但EVA作为增容剂改善了界面黏附力;铝粉则在高含量时出现团聚现象。该研究为热塑性淀粉基热熔胶的性能优化及应用拓展提供了理论支持。

关键词: 热熔胶, 热塑性淀粉, 生物基, 高粘接强度, 界面黏附

Abstract:

A high⁃adhesion thermoplastic starch⁃based hot melt adhesive (HMA) was prepared using a two⁃step method involving tartaric acid⁃modified thermoplastic starch (TPSTA1). Ethylene⁃vinyl acetate (EVA), rosin, and aluminum powders were incorporated into HMA via melt blending. The effects of varying EVA, rosin, and aluminum powder content on the adhesive's flow properties, adhesion strength, viscoelasticity, and compatibility were systematically investigated. Experimental results indicated that increasing the HMA (a blend of EVA and rosin) and aluminum powder contents initially enhanced adhesive strength, flowability, and surface energy, followed by a subsequent decrease. Optimized formulations significantly improved adhesive strength in copper lap joints, aluminum foil peel tests, and nonwoven fabric peel tests. Furthermore, incorporating HMA and aluminum powders disrupted the hydrogen bonding network within TPSTA1, enhancing starch chain molecular mobility. This caused a shift from predominantly viscoelastic to more viscous behavior, thereby improving the adhesive system's stability. Microstructural analysis indicated limited compatibility between TPSTA1 and rosin at high HMA contents, resulting in a sea⁃island morphology. EVA acted as a compatibility enhancer, improving interfacial adhesion. Aluminum powders dispersed uniformly at low concentrations but exhibited agglomeration tendencies at higher levels. This study provides theoretical support for optimizing the performance and expanding the application potential of thermoplastic starch⁃based hot melt adhesives.

Key words: hot melt adhesive, thermoplastic starch, biobased, high bonding strength, interfacial adhesion

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